Research progress on heat dissipation technology of vapor chamber

Vapor chamber is a new type of two-phase flow heat dissipation technology. It offers the benefits excellent thermal conductivity, uniform and consistent temperature, ability to reverse direction. addresses limitations conventional pipes, such as limited contact area, high resistance, non-uniform flow. In future, it will be an effective solution for cooling flux electron devices in electronic industry. This paper summarizes three types wicks: micro-channel, sintered powder, screen. article contrasts drawbacks. brief overview illustrates latest advancements mass transfer theory related vapor chamber, both domestically internationally. Scholars employ boiling transport modelling capture gas-liquid interface, ascertain critical flux, analyze laws working fluid temperature plate. analyzes several factors that affect performance plate, including selection fluid, filling rate liquid, size distribution position source input power, angle. Finally, this study forecasts practical applications taking into account surrounding environmental factors.